Patents

List of Patents

20. 7,579,279 - Method to passivate conductive surfaces during semiconductor processing 

19. 7,456,105 - CMP metal polishing slurry and process with reduced solids concentration 

18. 7,188,630 - Method to passivate conductive surfaces during semiconductor processing 

17. 7,001,498 - Electroplating apparatus and four mask TFT array process with electroplated metal 

16. 6,866,791 - Method of forming patterned nickel and doped nickel films via microcontact printing and uses 

15. 6,838,354 - Method for forming a passivation layer for air gap formation 

14. 6,767,828 - Method for forming patterns for semiconductor devices July 27, 2004 

13. 6,620,719 - Method of forming ohmic contacts using a self doping layer for thin-film transistors 

12. 6,495,005 - Electroplating apparatus 

11. 7989347B2 - Process for filling recessed features in a dielectric substrate

10. 20040266173 - Method for forming patterns for semiconductor devices 

9. 7579279 - Method to passivate conductive surfaces during semiconductor processing 

8. 20040224426 - Method of using an aqueous solution and composition thereof November 11, 

7. 20040119134 - Method for forming a passivation layer for air gap formation and structure thereof 

6. 20030068480 - TWI367543B, Method for forming patterns for semiconductor devices International Business Machines Corporation 

5. 20030038037 - Electroplating apparatus and four mask TFT array process with electroplated metal 

4. 20060223320 - Polishing technique to minimize abrasive removal of material and composition thereof 

3. 20080038994 - Method to Passivate Conductive Surfaces During Semiconductor Processing 

2. 20090093113 - Electrochemical etching of through silicon vias 

1. 11591699B2 - Electrochemical reactor for upgrading methane and small alkanes to longer alkanes and alkenes