Conferences Proceeding
54. Park Junghyun, Monsuru Olatunji Dauda, Mustapha Bello, John C Flake "The Future of Die-to-Die Copper Interconnects and Epoxy Dielectrics" In PRiME 2024 (October 6-11, 2024)
53. Monsuru Olatunji Dauda, Mustapha Bello, John C Hendershot, Junghyun Park, Ignace Agbadan, Soundarzo Tasnim, Orhan Kizilkaya, Phillip Sprunger, Koffi Yao, John C Flake "Selective CO2 Reduction to Multicarbon Products on Cu-Based Electrocatalysts in Membrane Electrode Assembly" In PRiME 2024 (October 6-11, 2024)
52. Mustapha Bello, Monsuru Olatunji Dauda, John C Hendershot, Junghyun Park, Ignace Agbadan, Soundarzo Tasnim, John C Flake "Comparative Selectivity of CO and CO2 Reduction Using Cu Electrocatalysts in Zero-Gap MEA Cells" In PRiME 2024 (October 6-11, 2024)
51. Kazuyuki Iwase, John C Flake "F05-Novel Catalysts and Electrodes 2" In PRiME 2024 (October 6-11, 2024)
50. Monsuru Olatunji Dauda, John C Hendershot, Mustapha Bello, Ignace Agbadan, Soundarzo Tasnim, Craig Plaisance, John C Flake "Selectivity and Durability in the Electrochemical Reduction of CO2 to C2 Products Using Cu-P, Cu-Sn and Cu-Se Electrocatalysts" In 245th ECS Meeting (May 26-30, 2024), 2024
49. Mustapha Bello, John C Hendershot, Monsuru Olatunji Dauda, Junghyun Park, John C Flake "pH Effects in the Electrochemical Reduction of CO at Cu Electrocatalysts in an MEA Cell Configuration" In 245th ECS Meeting (May 26-30, 2024), 2024
48. John C Flake, Mustapha Bello, Monsuru Olatunji Dauda, John C Hendershot, Ricardo Gonçlaves, Feng Jiao, Yushan Yan, Koffi Yao "Durability of CO and CO2 Electrolyzers with Copper Electrocatalysts, Gas Diffusion Electrodes, and Anion Exchange Membranes" In Electrochemical Society Meeting Abstracts 244, no. 24, pp. 1322-1322, The ECS, 2023
47. John Flake, Cameron Bachar, Albert S Dalum, Bruce Huynh, Hannah Porta, Rahul Ramaraju, Ella Sheets, Hingyu Yi, Barry Guillory, John Pendergast, Feng Jiao "Technoeconomic Assessment of Large-Scale Ethylene Production via the Electrochemical Reduction of CO2" In Electrochemical Society Meeting Abstracts 244, no. 24, pp. 1319-1319, The ECS, 2023
46. John Flake, Santosh Hanamant Vijapur "F01-Electrochemical Engineering 1" In 244th ECS Meeting (October 8-12, 2023), 2023
45. John Flake, Santosh Hanamant Vijapur "F01-Pollution Prevention" In 244th ECS Meeting (October 8-12, 2023), 2023
44. John C Hendershot, Mustapha Bello, Monsuru Olatunji Dauda, John C Flake "Understanding the Role of Cu Electocatalyst, Binder, and Membrane Interfaces in CO2 Electrolyzer Durability" In Meeting Abstracts 243, no. 26, pp. 1732-1732, The ECS, 2023
43. John Flake, Huyen N Dinh "F05 Tuesday Session 1: CO2 Electrolysis 1" In 240th ECS Meeting (October 10-14, 2021), 2021
42. Guangfang Li, Yuxin Fang, Christopher George Arges, John Flake "Electrochemical Oxidation of Methane in Superacid" In Meeting Abstracts 236, no. 18, pp. 989-989, The ECS, 2019
41. Yuxin Fang, Frank Mckay, Shengjie Zhang, Phillip Sprunger, John Flake, William Shelton, Ye Xu "Random alloys for fundamental electrocatalytic reactions" In Meeting Abstracts 257, The ACS, 2019
40. Rubaiyet Abedin, Sharareh Heidarian, John Flake, Francisco Hung "Computational Studies of Absorption Refrigeration Systems Using Mixtures of Refrigerants, Ionic Liquids and Deep Eutectic Solvents" In 2018 AIChE Annual Meeting
39. Xun Cheng, Yuxin Fang, John Flake, Ye Xu "Interaction of Thiol Ligands with Gold and Its Effect on Electrocatalytic CO2 Reduction" In 2018 AIChE Annual Meeting
38. Rubaiyet Abedin, Sharareh Heidarian, John C Flake, Francisco R Hung "Computational evaluation of mixtures of refrigerants, ionic liquids and deep eutectic solvents for absorption refrigeration systems" In Meeting Abstracts 256, The ACS, 2018
37. Yuxin Fang, John Flake "Functionalized Silica Facilitated Proton Coupled Electron Transfer in Electrochemical CO2 Reduction on Pd" In Meeting Abstracts 233, no. 31, pp. 1824-1824, The ECS, 2018
36. Benjamin B Peterson, John Flake "Reversibility of Brominated Carbon Electrodes for Lithium-Bromide Battery Applications" In Meeting Abstracts 231, no. 5, pp. 460-460, The ECS, 2017
35. Evan Michael Andrews, John Flake, Yuxin Fang "Electrochemical Reduction of CO2 Using Cu-Au Nanoparticles: Effects of Size and Composition" In Meeting Abstracts 231, no. 32, pp. 1566-1566, The Electrochemical Society, 2017
34. Xiaodan Cui, Yuxin Fang, Wangwang Xu, John Flake, Ying Wang "Coral-like Oxide-Derived Cu Decorated Sn for Efficient CO2 Electrochemical Reduction" In Electrochemical Society Meeting Abstracts 231, no. 38, pp. 1819-1819, The ECS, 2017
33. Yuxin Fang, Xun Cheng, Ye Xu, John Flake "Hydrogenation at Metal-Ligand Interfaces in CO2 Electrochemical Reduction" In Electrochemical Society Meeting Abstracts 231, no. 37, pp. 1723-1723, The ECS, 2017.
32. Xun Cheng, Yuxin Fang, Ye Xu, John Flake "Interaction of Thiol Ligands with Gold in Electrocatalytic CO2 Reduction" In Meeting Abstracts, no. 43, pp. 1966-1966, The Electrochemical Society, 2017.
31. William Earl Mustain, John Flake "CO2 to Fuels: Non-metallic Electrocatalysts" In PRiME 2016/230th ECS Meeting (October 2-7, 2016), ECS, 2016
30. John Flake, William Earl Mustain, Xiao-Dong Zhou "CO2 to Fuels: Anion Membrane and Electrolyte" In PRiME 2016, 230th ECS Meeting (October 2-7, 2016), ECS, 2016
29. John Flake, Guoying Qu "Activity Of Halide-Free Carboxylic Acid Fluxes At Sn Surfaces" In Meeting Abstracts, no. 2, pp. 135-135. The Electrochemical Society, 2013
28. Flake, John. "Surface Chemistry of Nafion-Immobilized Au 25 Clusters for Use in Electrochemical Reduction of CO< sub> 2</Sub>." In 224th ECS Meeting (October 27–November 1, 2013). Ecs, 2013.
27. "Non-Aqueous Halide-Free Chemistry at Copper and Tin Interfaces" John Flake, Louisiana State University IPC Electronic System Technologies Conference, Las Vegas, NV, October 13, 2013
26. Ren, Maoming, Evan Andrews, and John Flake "In-situ FTIR Analysis of CO2 Electrochemical Reduction at Copper Electrodes." In Meeting Abstracts, no. 14, pp. 1783-1783. The Electrochemical Society, 2012
25. Vegunta, Sri Sai S., Guoying Qu, Khiet Mai, Jacki Nguyen, and John C. Flake. "Halide-Free Flux Activity at Copper and Tin Surface." In Meeting Abstracts, no. 34, pp. 2747-2747. The Electrochemical Society, 2012
24. Z. Zhang, F. Wang, M. Le, M. Ren, J. Flake, P.T. Sprunger and R. L. Kurtz "Interaction of ZnO-supported Cu-oxides with CO and CO2: Electrochemical reduction of CO2 to CH3OH", AVS Oct 2011, Nashville, TN
23. Z. Zhang, F. Wang, M. Ren, F. Womack, M. Le, Y. Losoyvi, R. Kurtz, P. Sprunger, J. Flake, "Cu/CuOx Nanoclusters on ZnO(1010): Catalytic, Structure and CO2 adsorption", APS March Meeting 2011, Dallas, TX.
22. M. Ren, M. Le, Z. Zhang, P. Sprunger, R. Kurtz, G. Griffin, and J. Flake, "Electrochemical Reduction of CO2 to Methanol at Copper Based Surfaces", Electrochemical Society Fall Meeting, Oct 2011, Boston, MA.
21. Sri Sai S. Vegunta, Wanli Xu, John Peter Ngunjiri and John C. Flake, “Alkyl Functionalized (100) SiNWs for Lithium Ion Battery and Solar Cell Applications”, AICHE 158540 (2009), Nashville, TN.
20. Wanli Xu, and John C. Flake, “Electrolessly Etched Silicon Nanowire Composite Anode for Lithium Ion Battery”, AIChE 153889 (2009), Nashville, TN.
19. Joel Nino G Bugayong, Purnima Narayanan, and John C. Flake, “Deep Electrochemical Etching of Silicon”, AIChE 164493 (2009), Nashville, TN.
18. Johnpeter N. Ngunjiri, Sri S. Vegunta, Wanli Xu, and John C. Flake, “Electrografting of Organic Monolayers on Planar and Nanowire Silicon Substrates”, Electrochem. Soc. 902 2787 (2009), Vienna Austria
17. Sri Sai Sivakumar Vegunta, Johnpeter Ngunjiri, and John C. Flake, “Electrochemical Passivation of (100) Silicon in Alkyl Grignard Solutions”, Electrochem. Soc. 901 913 (2009) San Francisco, CA
16. Wanli Xu and J. C. Flake, “Integration and Applications of Electrochemically-Etched Silicon Nanowires”, 802 1808 (2008) Honolulu, HI.
15. Wanli Xu and John Flake, “Electrochemical Fabrication of Silicon Nanowires”, Electrochem. Soc. 702 39 (2007), Washington D.C.
14. Wanli Xu and John Flake, “Silicon Nanowire Fabrication & Device Integration”, Electrochem. Soc. 702 82 (2007), Washington D.C.
13. L. Gosset, S. Chhun, J. Guillan, R. Gras, J. Flake, R. Daamen, J. Michelon, P.-H. Hausmasser, S. Oliver, T. Descorps, J. Torres, “Self-Alligned Barrier Approach: Overview on Process Module Integration and Interconnect Performance Challenges”, 2006 IITC, San Francisco, CA.
12. W. Besling, T. Mourier, J. Flake, S. Courtas, J. Torres, “Extendibility of Copper Alloyed Seed for Reliability Improvement”, Advanced Metallization Conference, 2005, Colorado Springs, CO.
11. R. Fox, O. Hinsinger, C. Goldberg, A. Humbert, G. Imbert, P. Brun, E. Ollier,M. Zaleski, M. Mellier, J.-P. Jacquemin, J. Flake, V. Girault, P. Vannier, D. Reber, A. Schussler, J. Mueller, W. Besling, “High Performance k=2.5 ULK Backend Solution Using an Improved TFHM Architecture, Extendible to the 45nm Technology Node”, 2005 IEDM Washington DC.
10. L. Gosset, S. Chhun, W. Besling, J. Flake, “Characterization of a hybrid CoWP/SiCN architecture for sub 65nm technology nodes”, Advanced Metallization Conference 2005, Colorado Springs, Co.
9. J.C. Flake, J.P. Jacquemin, M. Hartig, E. Sicurani, P. Vannier, “Transient Behavior in Copper Electrofilling”, Proceedings 206th meeting of the ECS Honolulu, HI October 8, 2004.
8. M. Hartig, D. Cochran, J. Brown, F. Moreau, J. Flake, B. Emery, “Monitoring of Electrochemical Deposition Processes Using High Speed Collection of Process Waveforms”, Proceedings AEC/APC Symposium XVI Denver, CO, Sept. 18, 2004.
7. J. Flake, S. Usmani, J. Groschopf, K. Cooper, S.P. Sun, S. Thrasher, C. Goldberg, O. Anilturk, J. Farkas, “Post CMP Passivation of Cu Interconnects”, 202nd Meeting ECS, Salt Lake City, UT, Oct. 21, 2002.
6. J.C. Flake, C.R. Simpson, E. Acosta, “Effect of Suppressors on Copper Electrochemical Deposition Fill Efficiency”, 202nd ECS Meeting – Salt Lake City, UT Oct. 21, 2002.
5. K.C. Yu, J. Werking, C. Prindle, M. Kiene, M.–F. Ng, B. Wilson, A. Singhal, T. Stephens, F. Huang, T. Sparks, D. Denning, B. Brennan, J. Flake, R. Chowdhury, L. Svedberg, Y. Solomentsev, S. Kim, K. Cooper, S. Usmani, , K. Strozewski, K. Junker, C. Goldberg, and E. Weitzman, “Integration Challenges of 0.1mm CMOS Cu/Low-k Interconnects”, International Interconnect Technology Conference (IITC) Jun 2002.
4. K. Cooper, Y. Solomentsev, J. Flake and J. Cooper, “Non-Linear Effects During Electrolytic Deposition of Copper”, 200th Meeting of The ECS, San Francisco, CA 2001.
3. J. C. Flake, “In situ MIR FTIR Analysis of Silicon During Anodization”, Proceedings of the 194th Meeting of the Electrochemical Society, Boston, MA Nov. 5, 1998.
2. J.C. Flake, M. M. Rieger, P.A. Kohl, “Electrochemical Etching of Silicon in Nonaqueous and HF-free Electrolytes”, 191st Meeting of the Electrochemical Society, May 8, 1997, Montreal, Quebec, Canada.
1. J. C. Flake, M. M. Rieger, P. A. Kohl, “Environmentally Benign Silicon Etching in the Absence of Free Fluoride”, Proceedings of the Symposium on Environmental Aspects of Electrochemical Technology, The 190th Meeting of the ECS, San Antonio, TX, Oct. 8, 1996